ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD USING THE SAME

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD USING THE SAME

An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kim, WooChan, Choi, Changjun, Kim, Gotae, Kim, Wook, Moon, SangCheol
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.