ADHESIVE COMPOSITION AND METHODS OF FORMING THE SAME

An adhesive composition may include at least about 2 wt. % and not greater than 49 wt. % of a (meth)acrylic based polymeric component A for a total weight of the adhesive composition, at least about 51 wt. % of a (meth)acrylic based polymeric component B for a total weight of the adhesive compositio...

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Bibliographische Detailangaben
Hauptverfasser:	GADY, Olivia, GORDON, James N, LAI, Choung-Houng, CHEON, Kapsoo, CHAN, Nicky, CUI, Yubo
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive composition may include at least about 2 wt. % and not greater than 49 wt. % of a (meth)acrylic based polymeric component A for a total weight of the adhesive composition, at least about 51 wt. % of a (meth)acrylic based polymeric component B for a total weight of the adhesive composition; and at least about 0.1 wt. % and not greater than about 30 wt. % of a tackifier component for a total weight of the adhesive composition. The (meth)acrylic based polymeric component A may be acidic and may have a glass transition temperature (Tg) of at least about 40° C. The (meth)acrylic based polymeric component B may be basic and may have a glass transition temperature (Tg) of not greater than about 20° C.