BACKSIDE BRUSH FOR CLEANING WAFER AND CLEANING APPARATUS HAVING THE SAME

The present disclosure provides a backside brush for cleaning a backside of a wafer. The backside of the wafer has a central region and a periphery region surrounding the central region. The backside brush includes a backside brush core and a backside brush pad covering an outer surface of the backs...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	RO, YONG-SEOK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present disclosure provides a backside brush for cleaning a backside of a wafer. The backside of the wafer has a central region and a periphery region surrounding the central region. The backside brush includes a backside brush core and a backside brush pad covering an outer surface of the backside brush core. The backside brush pad includes a soft pad and an abrasive pad. The soft pad of the backside brush pad covers a portion of the outer surface the backside brush core and is configured to brush the central region of the backside of the wafer. The abrasive pad of the backside brush pad covers another portion of the outer surface of the backside brush core and is configured to brush the periphery region of the backside of the wafer.