TRACK SYSTEM AND METHOD OF PROCESSING SEMICONDUCTOR WAFERS

The present disclosure provides a track system for processing semiconductor wafers held by a plurality of front opening universal pods (FOUPs). The track system includes a process zone, a first common zone, and a second common zone. The process zone includes a first group of process modules and a se...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KWON, BYUNG-IN, JANG, SUNGKUN, LIM, JONG-KILL
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure provides a track system for processing semiconductor wafers held by a plurality of front opening universal pods (FOUPs). The track system includes a process zone, a first common zone, and a second common zone. The process zone includes a first group of process modules and a second group of process modules. The first common zone is coupled to the first group of process modules of the process zone. The first common zone includes a first robot and at least two first FOUP ports. The second common zone is coupled to the second group of process modules of the process zone. The second common zone includes a second robot and at least two second FOUP ports.