SPECTROSCOPIC SYSTEM, OPTICAL INSPECTION METHOD, AND SEMICONDUCTOR DEVICE FABRICATION METHOD

A semiconductor fabrication method includes performing a first treatment process on a substrate, inspecting the substrate using a spectroscopic system that includes a light entrance part, a light exit part, a diffraction grating, and a controllable mirror device, and performing a second treatment pr...

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Bibliographische Detailangaben
Hauptverfasser:	Yang, Yusin, JANG, SUNGHO, Ko, Kang-Woong, Kim, Minsu, Sohn, Younghoon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A semiconductor fabrication method includes performing a first treatment process on a substrate, inspecting the substrate using a spectroscopic system that includes a light entrance part, a light exit part, a diffraction grating, and a controllable mirror device, and performing a second treatment process of the substrate. The step of performing the inspection process includes separating incident light into a plurality of light rays each having different wavelengths, the incident light being provided to the light entrance part and diffracted at the diffraction grating, and moving the controllable mirror device to reflect a first light ray from among the plurality of light rays having a first wavelength to the light exit part.