APPARATUS AND METHOD FOR AUTOMATED SOLDERING PROCESS

In at least one embodiment, an apparatus for an automated soldering process is provided. The apparatus includes a stepper motor to provide solder and a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire. The apparatus inclu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HANS, Michael, SEMBER, John M, FISHER, Michael A
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:In at least one embodiment, an apparatus for an automated soldering process is provided. The apparatus includes a stepper motor to provide solder and a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire. The apparatus includes a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire. The apparatus includes a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.