Pipe Heating Device and Substrate Processing Apparatus

There is provided a pipe heating device, including; a sensor installed in a gas pipe; a heating part having a heat generation portion arranged so as to cover the gas pipe except for a region of the gas pipe where the sensor is installed; and a heat conducting member attached between an outer periphe...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIMOTO, Tomohisa, KOMORI, Eiichi
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:There is provided a pipe heating device, including; a sensor installed in a gas pipe; a heating part having a heat generation portion arranged so as to cover the gas pipe except for a region of the gas pipe where the sensor is installed; and a heat conducting member attached between an outer peripheral surface of the gas pipe and the sensor and formed of a material having a higher thermal conductivity than the gas pipe.