SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

A semiconductor device and a semiconductor module which can be reduced in size while ensuing insulation are provided. In the semiconductor device, a lead frame on which a circuit pattern is formed is provided on an insulation substrate; the circuit pattern of the lead frame is joined to the back-sid...

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Bibliographische Detailangaben
Hauptverfasser:	SATO, Kuniyuki, ROKUBUICHI, Hodaka, KITAI, Kiyofumi, SANDA, Yasuyuki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device and a semiconductor module which can be reduced in size while ensuing insulation are provided. In the semiconductor device, a lead frame on which a circuit pattern is formed is provided on an insulation substrate; the circuit pattern of the lead frame is joined to the back-side electrode of a semiconductor chip via a solder layer, and the lead frame is electrically connected with the top-side electrode of the semiconductor chip via a wire; the lead frame 1 includes a terminal inside a mold-sealing resin and a terminal exposed to a space outside the mold-sealing resin, and the terminal is connected to a terminal block via a solder layer; and the lead frame, the insulation substrate, the semiconductor chip and the terminal block are integrally molded and sealed by the mold-sealing resin.