BUSHING PORTION AND A SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

A substrate processing apparatus may include a stage having a plane defined by a first direction and a second direction crossing each other, a pin arranged in an opening defined in the stage and extending in a third direction crossing the plane, and a bushing portion below the stage. The pin may be...

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Bibliographische Detailangaben
Hauptverfasser:	LIM, Heesung, KIM, Youngkweon
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate processing apparatus may include a stage having a plane defined by a first direction and a second direction crossing each other, a pin arranged in an opening defined in the stage and extending in a third direction crossing the plane, and a bushing portion below the stage. The pin may be inserted in an insertion hole defined in the bushing portion, the insertion hole may overlap with the opening, and a first hole extending to the insertion hole in a direction parallel to the plane may be defined in the bushing portion.