RELEASE AGENT FOR REACTIVE HOT MELT RESIN

The present invention provides a release agent for a reactive hot melt resin, wherein a dispersion term (δD) in the Hansen solubility parameters falls within the range of 14.0 to 21.0 MPa0.5, a dipole interaction force term (δP) falls within the range of 0 to 10.5 MPa0.5, and a hydrogen bond term (δ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUJIWARA, Toyokuni, SAITOU, Yukie, NINOMIYA, Atsushi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides a release agent for a reactive hot melt resin, wherein a dispersion term (δD) in the Hansen solubility parameters falls within the range of 14.0 to 21.0 MPa0.5, a dipole interaction force term (δP) falls within the range of 0 to 10.5 MPa0.5, and a hydrogen bond term (δH) falls within the range of 0 to 13.5 MPa0.5. Preferably, the adhesive for a reactive hot melt resin is at least one type of solvent selected from a group consisting of benzoic acid esters, tetrahydrofurfuryl alcohol, and tetrahydrofurfuryl (meth)acrylate. The reactive hot melt resin preferably contains an urethane prepolymer having an isocyanate group, and the urethane bond content in the urethane prepolymer is preferably within the range of 0.1 to 3 mol/kg.