Method for Integrating an Electrical Circuit in a Device and Device
A method integrates an electrical circuit into a device. The device has an integration surface consisting of a first material. The method includes processing the integration surface in order to form connection elements in order to increase an adhesion of a second material to the integration surface....
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A method integrates an electrical circuit into a device. The device has an integration surface consisting of a first material. The method includes processing the integration surface in order to form connection elements in order to increase an adhesion of a second material to the integration surface. The second material differs from the first material. The method also includes arranging the electrical circuit adjacent to the processed integration surface. The method furthermore includes applying a volume of the second material at least over the integration surface in order to enclose the electrical circuit in a fluid-tight manner. |
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