INTEGRATED CAPACITIVE DISCHARGE ELECTRICAL BONDING ASSURANCE SYSTEM

In one embodiment, an aircraft electronics system includes a hardware processor, a charge collection circuit to collect charge; a switching circuit controlled by the hardware processor to discharge the charge collected on the charge collection circuit through a bonding circuit formed from a chassis...

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Bibliographische Detailangaben
1. Verfasser: Froman, Gary S
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In one embodiment, an aircraft electronics system includes a hardware processor, a charge collection circuit to collect charge; a switching circuit controlled by the hardware processor to discharge the charge collected on the charge collection circuit through a bonding circuit formed from a chassis and a bonding surface; and a voltage measurement circuit to measure a voltage difference between measurement terminals across the chassis and the bonding surface.