JOINED COMPONENT THROUGH WHICH PROCESS FLUID PASSES IN SEMICONDUCTOR MANUFACTURING PROCESS OR DISPLAY MANUFACTURING PROCESS

The present invention relates to a joined component used in a semiconductor manufacturing process or a display manufacturing process, in which the joined component is formed by welding parent members by friction stir welding.

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Bibliographische Detailangaben
1. Verfasser:	AHN, Bum Mo
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PIPES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	The present invention relates to a joined component used in a semiconductor manufacturing process or a display manufacturing process, in which the joined component is formed by welding parent members by friction stir welding.