EPOXY/THIOL RESIN COMPOSITIONS, METHODS, AND TAPES

Curable epoxy/thiol resin compositions, methods of curing, methods of bonding substrates, and tapes including the cured polymeric material, wherein the curable epoxy/thiol resin composition includes: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule;...

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Bibliographische Detailangaben
Hauptverfasser:	Kryger, Matthew J, Fronek, Daniel R, Kropp, Michael A, Galush, Thomas B
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Curable epoxy/thiol resin compositions, methods of curing, methods of bonding substrates, and tapes including the cured polymeric material, wherein the curable epoxy/thiol resin composition includes: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two primary thiol groups; a silane-functionalized adhesion promoter; a nitrogen-containing catalyst for curing the epoxy resin; and optionally a cure inhibitor.