Molded Laser Package with Electromagnetic Interference Shield and Method of Making

A semiconductor device has a substrate comprising a carrier and an interposer disposed on the carrier. An electrical component is disposed over a first surface of the interposer. An interconnect structure is disposed over the first surface of the interposer. An encapsulant is deposited over the elec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Wanil, Lee, SangDuk, Lee, HeeSoo, Yang, DeokKyung, Lee, HunTeak
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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