DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING

Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.

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Bibliographische Detailangaben
Hauptverfasser: HOLLERBACH, Uwe, LAIDIG, Thomas L
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.