POSITIONING STRUCTURE

The present invention discloses a positioning structure, including: a first substrate, a bonding member, a positioning member, and a first fixing member. The first substrate includes a first through hole. The bonding member is disposed between the first substrate and the positioning member to bond t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WU, HUNG-YUN, CHEN, HSIAO-FAN, HUANG, CHING-YEN, WANG, HUIN, TANG, YIUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention discloses a positioning structure, including: a first substrate, a bonding member, a positioning member, and a first fixing member. The first substrate includes a first through hole. The bonding member is disposed between the first substrate and the positioning member to bond the first substrate and the positioning member, a position of the bonding member being corresponding to the first through hole. The first fixing member is fixed in the positioning member via the first through hole of the first substrate, to fix the positioning member on the first substrate.