DETECTING AND CORRECTING DEFICIENCIES IN SURFACE CONDITIONS FOR BONDING APPLICATIONS

A method adjusts a mechanical process on a material in order to improve bonding characteristics of the material. A system collects surface micro-roughness measurements of a material, and places discrete sampling regions on the material. The system analyzes the surface micro-roughness measurements for each of the discrete sampling regions on the material, and identifies a lowest micro-roughness measurement in a discrete sampling region from a plurality of discrete sampling regions on the material. The system compares the lowest micro-roughness measurement to a threshold micro-roughness measurement in order to determine that the lowest micro-roughness measurement is less than the threshold micro-roughness measurement. In response to determining that the lowest micro-roughness measurement is less than the threshold micro-roughness measurement, the system adjusts a mechanical process on the material until micro-roughness measurements for each of the discrete sampling regions are greater than the threshold micro-roughness measurement.