POLYIMIDE FILM

A polyimide film having, when measured at a film thickness of 10 μm, a weight residue ratio of 99.0% or more when held at 400° C. for 4 hours, a YI (yellow index) of 10 or less, and a coefficient of linear thermal expansion between 100 and 350° C. of 55 ppm/K or less. The polyimide film is excellent...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HISANO, Nobuharu, NAKAGAWA, Miharu, OKA, Takuya
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A polyimide film having, when measured at a film thickness of 10 μm, a weight residue ratio of 99.0% or more when held at 400° C. for 4 hours, a YI (yellow index) of 10 or less, and a coefficient of linear thermal expansion between 100 and 350° C. of 55 ppm/K or less. The polyimide film is excellent in transparency and heat resistance, has a low linear thermal expansion coefficient, and can be suitably used for a substrate for a display, a touch panel, or a solar cell.