RADIATION CURABLE ORGANOSILICON RESIN COMPOSITION

One of the purposes of the present invention is to provide a radiation curable organosilicon resin composition which offers a cured product having a sufficient gas barrier property and which further has workability enough for use in spin coating or inkjetting. The present invention provides a radiat...

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Bibliographische Detailangaben
Hauptverfasser: IGUCHI, Hiroyuki, KASHIWAGI, Tsutomu
Format: Patent
Sprache:eng
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Zusammenfassung:One of the purposes of the present invention is to provide a radiation curable organosilicon resin composition which offers a cured product having a sufficient gas barrier property and which further has workability enough for use in spin coating or inkjetting. The present invention provides a radiation curable organosilicon resin composition comprising 100 parts by mass of (A) a (meth)acryloyloxy group-containing organosilane represented by the formula (1) which has a (meth)acryloyloxy group or a monovalent organic group having 4 to 25 carbon atoms and having one, two, or three of said (meth)acryloyloxy group, and 1 to 50 parts by mass of (B) a photopolymerization initiator.