ELECTROMAGNETIC WAVE ABSORBER AND ELECTROMAGNETIC WAVE ABSORBER-ATTACHED MOLDED ARTICLE

An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrical conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrical conductive layer (30) is disposed on the other principal...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Ueda, Eri, Ui, Takehiro, Takeda, Yuuki, Yamagata, Kazuto, Ukei, Hiroichi, Machinaga, Hironobu
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrical conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrical conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) includes indium oxide as a main component, has a polycrystalline structure, and has a sheet resistance of 260 to 500Ω/□ and a specific resistance of 5×10−4 Ω·cm or more.