POLYPROPYLENE-BASED RESIN COMPOSITION, PELLET, AND MOLDED OBJECT

A polypropylene-based resin composition containing a polypropylene-based resin (A) which has a melting endotherm (ΔH-D) of 0 J/g or more and 40 J/g or less and which does not exhibit an observable melting point (Tm-D) or has a melting point (Tm-D) of 0° C. or higher and lower than 90° C., and a poly...

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Hauptverfasser: MINAMI, Yutaka, FUJII, Nozomu, KANAMARU, Masami
Format: Patent
Sprache:eng
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Zusammenfassung:A polypropylene-based resin composition containing a polypropylene-based resin (A) which has a melting endotherm (ΔH-D) of 0 J/g or more and 40 J/g or less and which does not exhibit an observable melting point (Tm-D) or has a melting point (Tm-D) of 0° C. or higher and lower than 90° C., and a polypropylene-based resin (B) which has a melting endotherm (ΔH-D) of more than 40 J/g and 125 J/g or less.