SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

According to one embodiment, a semiconductor device comprises a first terminal on a first surface of a substrate and a first semiconductor chip on the first surface of the substrate and including a second terminal. A first connector electrically connects the first terminal to the second terminal. A...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: AKADA, Yusuke
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to one embodiment, a semiconductor device comprises a first terminal on a first surface of a substrate and a first semiconductor chip on the first surface of the substrate and including a second terminal. A first connector electrically connects the first terminal to the second terminal. A second semiconductor chip is on the first surface of the substrate. An adhesive resin is between the second semiconductor chip and the first surface. A portion of the first connector is embedded in the adhesive resin. The first semiconductor chip is spaced from the adhesive resin in a direction parallel to the first surface.