STACKED WIRE-BOND DICE ATTACHED BY PILLARS OR BUMPS ABOVE A FLIP-CHIP DIE ON A SEMICONDUCTOR PACKAGE SUBSTRATE
A wire-bond memory die is coupled to a system-on-chip processor where the processor is flip-chip mounted on a semiconductor package substrate, and the wire-bond memory die is also flip-chip configured through a redistribution layer that pins out to a series of pillars that contact the semiconductor...
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| creator | Karhade, Omkar Sawyer, Holly A Ganesan, Sanka Chavali, Sri Chaitra Jyotsna Sankman, Robert L Mallik, Debendra Li, Zhaozhi George Vakanas, George |
| description | A wire-bond memory die is coupled to a system-on-chip processor where the processor is flip-chip mounted on a semiconductor package substrate, and the wire-bond memory die is also flip-chip configured through a redistribution layer that pins out to a series of pillars that contact the semiconductor package substrate. The wire-bond memory die is stacked on the processor and the redistribution layer overhangs the processor to contact the series of pillars. |
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The wire-bond memory die is stacked on the processor and the redistribution layer overhangs the processor to contact the series of pillars.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | STACKED WIRE-BOND DICE ATTACHED BY PILLARS OR BUMPS ABOVE A FLIP-CHIP DIE ON A SEMICONDUCTOR PACKAGE SUBSTRATE |
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