STACKED WIRE-BOND DICE ATTACHED BY PILLARS OR BUMPS ABOVE A FLIP-CHIP DIE ON A SEMICONDUCTOR PACKAGE SUBSTRATE

A wire-bond memory die is coupled to a system-on-chip processor where the processor is flip-chip mounted on a semiconductor package substrate, and the wire-bond memory die is also flip-chip configured through a redistribution layer that pins out to a series of pillars that contact the semiconductor...

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Bibliographische Detailangaben
Hauptverfasser: Karhade, Omkar, Sawyer, Holly A, Ganesan, Sanka, Chavali, Sri Chaitra Jyotsna, Sankman, Robert L, Mallik, Debendra, Li, Zhaozhi George, Vakanas, George
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A wire-bond memory die is coupled to a system-on-chip processor where the processor is flip-chip mounted on a semiconductor package substrate, and the wire-bond memory die is also flip-chip configured through a redistribution layer that pins out to a series of pillars that contact the semiconductor package substrate. The wire-bond memory die is stacked on the processor and the redistribution layer overhangs the processor to contact the series of pillars.