METHOD OF CUTTING SUBSTRATE AND METHOD OF SINGULATING SEMICONDUCTOR CHIPS

METHOD OF CUTTING SUBSTRATE AND METHOD OF SINGULATING SEMICONDUCTOR CHIPS

A method of cutting a substrate including a device region and a scribe lane region includes selectively forming a passivation layer in the device region of the substrate, selectively forming a self-assembled monolayer on the passivation layer, and performing plasma cutting in the scribe lane region.

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Bibliographische Detailangaben
Hauptverfasser: SHIN, SEUNG-HUN, YOO, JAE-KYUNG, JEON, CHANG-SEONG, LEE, TEAK-HOON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of cutting a substrate including a device region and a scribe lane region includes selectively forming a passivation layer in the device region of the substrate, selectively forming a self-assembled monolayer on the passivation layer, and performing plasma cutting in the scribe lane region.