COPPER SULFATE, COPPER SULFATE SOLUTION, PLATING SOLUTION, METHOD FOR PRODUCING COPPER SULFATE, METHOD FOR PRODUCING SEMICONDUCTOR CIRCUIT BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS

Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.

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Bibliographische Detailangaben
Hauptverfasser:	ISHII, Masafumi, NAGAURA, Tomota
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INORGANIC CHEMISTRY METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.