METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE

A light emitting device including a molded package having leads including a pair of a first lead and a second lead, a molded resin, and a recess, where an upper surface of the leads is partially exposed from a bottom surface of the recess. The device further including a light emitting component moun...

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Bibliographische Detailangaben
Hauptverfasser:	SASAOKA, Shimpei, NAKABAYASHI, Takuya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A light emitting device including a molded package having leads including a pair of a first lead and a second lead, a molded resin, and a recess, where an upper surface of the leads is partially exposed from a bottom surface of the recess. The device further including a light emitting component mounted on the bottom surface, and at least one sealing member located in the recess to cover the light emitting component. At least one of the first lead and the second lead has a groove on an upper surface thereof, where the groove is positioned so as to correspond to a corner on the bottom surface of the recess in a cross sectional view. A portion of the molded resin located within the groove is exposed from the bottom surface. A surface of the corner is composed of a curved surface, and the sealing member covers the corner.