SUBSTRATE TREATMENT APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WORKPIECE SUBSTRATE

In one embodiment, a substrate treatment apparatus includes a substrate holder configured to hold a substrate provided with a film. The apparatus further includes a film treatment module configured to treat the film in accordance with warpage of the substrate such that the film includes a first regi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ito, Fuyuma, Yoshimizu, Yasuhito, Kitagawa, Hakuba
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In one embodiment, a substrate treatment apparatus includes a substrate holder configured to hold a substrate provided with a film. The apparatus further includes a film treatment module configured to treat the film in accordance with warpage of the substrate such that the film includes a first region having a first film quality or a first film thickness and a second region having a second film quality or a second film thickness different from the first film quality or the first film thickness.