HIGH-ASPECT RATIO ELECTROPLATED STRUCTURES AND ANISOTROPIC ELECTROPLATING PROCESSES

HIGH-ASPECT RATIO ELECTROPLATED STRUCTURES AND ANISOTROPIC ELECTROPLATING PROCESSES

A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the se...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Pesavento, Paul V, Swanson, Kurt C, Riemer, Douglas P, Starkey, Joseph D, Lang, Matthew S, Ladwig, Peter F
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INDUCTANCES
MAGNETS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Beschreibung
Zusammenfassung:A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.