SOLDER MASK VOID REGIONS FOR PRINTED CIRCUIT BOARDS

A printed circuit board having a substrate layer, at least one electrically conductive trace disposed on the substrate layer, and a solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask later includes a void region over at least a portion...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Contreras, Stephen F, Engler, David W
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A printed circuit board having a substrate layer, at least one electrically conductive trace disposed on the substrate layer, and a solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask later includes a void region over at least a portion of the electrically conductive trace. Also, a method of optimizing printed circuit board designing including selecting printed circuit board data comprising at least a solder mask layer area, varying the solder mask layer area, determining an insertion loss value for each varied solder mask layer area, comparing the insertion loss values for each varied solder mask layer area, and selecting a solder mask layer area based on the comparing.