SYSTEMS, DEVICES AND METHODS RELATED TO SHIELDED MODULES

Systems, devices and methods related to shielded modules. In some embodiments, a module processing system can include a first sub-system configured to prepare or provide a carrier assembly that includes a ring having an inner boundary and configured to be utilized in a deposition apparatus, and a st...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	READ, Matthew Sean, NGUYEN, Hoang Mong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Systems, devices and methods related to shielded modules. In some embodiments, a module processing system can include a first sub-system configured to prepare or provide a carrier assembly that includes a ring having an inner boundary and configured to be utilized in a deposition apparatus, and a stencil having a plurality of openings, with each opening dimensioned to receive a portion of a packaged module. The carrier assembly can further include an adhesive member that attaches the stencil to the ring such that the stencil is positioned at least partially within the inner boundary of the ring, to allow the carrier assembly to be utilized in the deposition apparatus. The system can further include a second sub-system configured to position a plurality of packaged modules over the respective openings of the stencil to thereby allow the plurality of packaged modules to be processed in the deposition apparatus.