SUBSTRATE TREATING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SUBSTRATE TREATING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

According to one embodiment, a substrate treating method includes: providing a first liquid onto a pattern on a substrate; providing, after the first liquid is provided, a second liquid containing a first substance to form a film containing the first substance on the pattern; providing, after the se...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ITO, Fuyuma, YANAI, Naomi, YOSHIMIZU, Yasuhito
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to one embodiment, a substrate treating method includes: providing a first liquid onto a pattern on a substrate; providing, after the first liquid is provided, a second liquid containing a first substance to form a film containing the first substance on the pattern; providing, after the second liquid is provided onto the pattern, a third liquid; turning the third liquid into gas; and turning, after the third liquid is turned into gas, the film into gas.