Laser Processing Apparatus, Laser Processing Method, and Method for Manufacturing Semiconductor Apparatus

Laser Processing Apparatus, Laser Processing Method, and Method for Manufacturing Semiconductor Apparatus

A laser processing apparatus includes a holder configured to hold a workpiece, a head, a first nozzle, and a driver. The head is configured to irradiate a first portion of a main surface of the workpiece with a laser beam. The first nozzle is configured to supply a first liquid to the first portion....

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Hauptverfasser: MATSUMURA, Tamio, FUKUNAGA, Keigo
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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creator MATSUMURA, Tamio
FUKUNAGA, Keigo
description A laser processing apparatus includes a holder configured to hold a workpiece, a head, a first nozzle, and a driver. The head is configured to irradiate a first portion of a main surface of the workpiece with a laser beam. The first nozzle is configured to supply a first liquid to the first portion. The driver is configured to drive the holder in such a manner that the workpiece can revolve around the optical axis of the laser beam at the first portion. Accordingly, the workpiece can be efficiently processed, and debris of the workpiece can be prevented from adhering to the main surface of the workpiece.
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subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Laser Processing Apparatus, Laser Processing Method, and Method for Manufacturing Semiconductor Apparatus
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