Laser Processing Apparatus, Laser Processing Method, and Method for Manufacturing Semiconductor Apparatus

A laser processing apparatus includes a holder configured to hold a workpiece, a head, a first nozzle, and a driver. The head is configured to irradiate a first portion of a main surface of the workpiece with a laser beam. The first nozzle is configured to supply a first liquid to the first portion....

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Bibliographische Detailangaben
Hauptverfasser:	MATSUMURA, Tamio, FUKUNAGA, Keigo
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing apparatus includes a holder configured to hold a workpiece, a head, a first nozzle, and a driver. The head is configured to irradiate a first portion of a main surface of the workpiece with a laser beam. The first nozzle is configured to supply a first liquid to the first portion. The driver is configured to drive the holder in such a manner that the workpiece can revolve around the optical axis of the laser beam at the first portion. Accordingly, the workpiece can be efficiently processed, and debris of the workpiece can be prevented from adhering to the main surface of the workpiece.