PRINTED CIRCUIT BOARD DEVICE FOR AN IMAGE CAPTURE MODULE FOR A CAMERA, IMAGE CAPTURE MODULE THAT INCLUDES A PRINTED CIRCUIT BOARD DEVICE, AND METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD DEVICE

A printed circuit board device for an image capture module for a camera. The printed circuit board device includes a printed circuit board, an image sensor, and at least one copper layer and/or carbon layer. The printed circuit board includes a first main surface and a second main surface opposite f...

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Bibliographische Detailangaben
Hauptverfasser:	Winkler, Martin, Eschler, Johannes
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A printed circuit board device for an image capture module for a camera. The printed circuit board device includes a printed circuit board, an image sensor, and at least one copper layer and/or carbon layer. The printed circuit board includes a first main surface and a second main surface opposite from the first main surface. The image sensor is or may be situated on the first main surface of the printed circuit board. The copper layer that contains copper at least in part, and/or the carbon layer that contains carbon at least in part, are/is situated on the second main surface and formed for stabilization of the printed circuit board.