HEAT SINK AND METHOD FOR MANUFACTURING SAME

Provided is a heat sink that has a clad structure of a Cu-Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu-Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu laye...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO, Kouichi, TERAO, Hoshiaki
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS BLASTING CASTING CHEMISTRY COMBINED OPERATIONS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS HEAT EXCHANGE IN GENERAL HEATING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY OTHER WORKING OF METAL PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS UNIVERSAL MACHINE TOOLS WEAPONS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	Provided is a heat sink that has a clad structure of a Cu-Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu-Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the Cu-Mo composite layers or comprises three or more Cu-Mo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the Cu-Mo composite layers are outermost layers on both sides, wherein each of the Cu-Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.