PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

A semiconductor package including a package substrate including a mounting region and at least one through-hole arranged in the mounting region, and a semiconductor chip mounted on the mounting region, the semiconductor chip including a first side and a second side, the second side of the semiconduc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Jang, Keun-ho
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package including a package substrate including a mounting region and at least one through-hole arranged in the mounting region, and a semiconductor chip mounted on the mounting region, the semiconductor chip including a first side and a second side, the second side of the semiconductor chip being opposite to the first side of the semiconductor chip, the at least one through-hole of the package substrate being closer to the second side of the semiconductor chip than the first side of the semiconductor chip may be provided.