Film Forming Apparatus and Film Forming Method

A film forming apparatus, which forms a film on a substrate mounted on a stage in a process chamber by supplying a film forming gas to the substrate from a film forming gas supply facing the stage, includes: a first annular body surrounding the stage with a gap interposed between the stage and the f...

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Bibliographische Detailangaben
Hauptverfasser:	NUNOSHIGE, Yu, KEIMOTO, Yuki, FUJII, Yasushi, KUWADA, Hirotaka
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A film forming apparatus, which forms a film on a substrate mounted on a stage in a process chamber by supplying a film forming gas to the substrate from a film forming gas supply facing the stage, includes: a first annular body surrounding the stage with a gap interposed between the stage and the first annular body; a second annular body extending downward from an inner peripheral portion of the first annular body; and a third annular body extending from a peripheral portion of the stage such that the third annular body has a flow path defining surface extending along an inner peripheral surface of the second annular body and a lower end surface of the second annular body.