BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR PRODUCING BONDING STRUCTURE
A bonding member (10) includes surface-processed silver surfaces (11a, 11b).
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| creator | CHEN, Chuantong ISHINA, Toshiyuki SUGANUMA, Katsuaki NOH, Seungjun CHOE, Chanyang |
| description | A bonding member (10) includes surface-processed silver surfaces (11a, 11b). |
| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR PRODUCING BONDING STRUCTURE |
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