BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR PRODUCING BONDING STRUCTURE

A bonding member (10) includes surface-processed silver surfaces (11a, 11b).

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, Chuantong, ISHINA, Toshiyuki, SUGANUMA, Katsuaki, NOH, Seungjun, CHOE, Chanyang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A bonding member (10) includes surface-processed silver surfaces (11a, 11b).