THERMALLY EXPANDABLE MATERIAL, SHEET MATERIAL, CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, COMPUTER READABLE STORAGE MEDIUM, ELECTRONIC APPARATUS, AND STRUCTURE TO ANALYZE HEAT-GENERATION POSITION

THERMALLY EXPANDABLE MATERIAL, SHEET MATERIAL, CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, COMPUTER READABLE STORAGE MEDIUM, ELECTRONIC APPARATUS, AND STRUCTURE TO ANALYZE HEAT-GENERATION POSITION

A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to e...

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Bibliographische Detailangaben
Hauptverfasser: KUROSAWA, Satoshi, IWAMOTO, Kenji
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.