FIBER REINFORCED POLYMER COMPOSITION

The invention relates to a fiber reinforced thermoplastic molding composition comprising a thermoplastic polymer and reinforcing fibers, wherein the composition comprises (i) a thermoplastic polymer selected from the group consisting of polyesters, polyamides, polycarbonates, polyphenylene sulphides...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	VAN DER BURGT, Frank Peter Theodorus Johannes, LIAO, Ruogu
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY GENERAL PROCESSES OF COMPOUNDING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MINERAL OR SLAG WOOL ORGANIC MACROMOLECULAR COMPOUNDS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TELEPHONIC COMMUNICATION THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	The invention relates to a fiber reinforced thermoplastic molding composition comprising a thermoplastic polymer and reinforcing fibers, wherein the composition comprises (i) a thermoplastic polymer selected from the group consisting of polyesters, polyamides, polycarbonates, polyphenylene sulphides (PPS), polyphenylene ethers (PPO), polyetheretherketones (PEEK), polyaryletherketones (PAEK), polyamidimides (PAI), polyetherimides (PEI) and liquid crystal polymers (LCPs), and combinations thereof and (ii) silicon-boron glass fibers consisting predominantly of silicon dioxide (SiO2) and boron trioxide (B2O3).