SEMICONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF

A method of manufacturing a semiconductive structure includes receiving a first substrate; disposing an interconnection layer on the first substrate; forming a plurality of conductors over the interconnection layer; filing gaps between the plurality of conductors with a film; forming a barrier layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSAI, SHANG-YING, CHANG, KUEI-SUNG, HSIEH, CHENG-YU, LIU, YENNG
Format: Patent
Sprache:eng
Schlagworte:
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:A method of manufacturing a semiconductive structure includes receiving a first substrate; disposing an interconnection layer on the first substrate; forming a plurality of conductors over the interconnection layer; filing gaps between the plurality of conductors with a film; forming a barrier layer over the film; removing the barrier layer; and partially removing the film to expose a portion of the interconnection and leave a portion of the interconnection layer covered by the film.