THIN-FILM ELECTRODE ASSEMBLY WITH SOFT OVERMOLD

The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed...

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Bibliographische Detailangaben
Hauptverfasser:	Pepin, Brian, Sabesan, Shiv, Lu, Bo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY ELECTROTHERAPY HUMAN NECESSITIES HYGIENE INSULATORS MAGNETOTHERAPY MEDICAL OR VETERINARY SCIENCE RADIATION THERAPY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ULTRASOUND THERAPY
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Beschreibung
Zusammenfassung:	The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire.