AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF PRODUCING THE SAME

An aqueous dispersion for chemical mechanical polishing includes: (A) silica particles; (B) at least one kind selected from the group consisting of organic acids and salts thereof; and (C) at least one kind selected from the group consisting of amino group-containing silane compounds and condensates...

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Bibliographische Detailangaben
Hauptverfasser: Okamoto, Masashi, Kunitani, Eiichirou, Hirai, Yuuji, Nakanishi, Kouji
Format: Patent
Sprache:eng
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Zusammenfassung:An aqueous dispersion for chemical mechanical polishing includes: (A) silica particles; (B) at least one kind selected from the group consisting of organic acids and salts thereof; and (C) at least one kind selected from the group consisting of amino group-containing silane compounds and condensates thereof, and has a pH of 7 or more and 14 or less.