POLISHING LIQUID COMPOSITION

POLISHING LIQUID COMPOSITION

The present disclosure relates to a polishing composition containing: cerium oxide particles A; an oligosaccharide B; and water. The oligosaccharide B contains a saccharide made up of 3 to 5 glucoses linked together. In the oligosaccharide B, a content of a saccharide made up of 8 or more glucoses l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OYAMA, Tsubasa, DOI, Haruhiko
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
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Beschreibung
Zusammenfassung:The present disclosure relates to a polishing composition containing: cerium oxide particles A; an oligosaccharide B; and water. The oligosaccharide B contains a saccharide made up of 3 to 5 glucoses linked together. In the oligosaccharide B, a content of a saccharide made up of 8 or more glucoses linked together is 27 mass % or less.