INDUCTORS FORMED WITH THROUGH GLASS VIAS

INDUCTORS FORMED WITH THROUGH GLASS VIAS

Aspects of the present disclosure provide three-dimensional (3D) through-glass-via (TGV) inductors for use in electronic devices. In some embodiments, a first portion of a 3D TGV inductor may be formed in a first wafer and a second portion of a 3D TGV may be formed in a second wafer. The first porti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VELEZ, Mario Francisco, YUN, Changhan Hobie, THADESAR, Paragkumar Ajaybhai, PARK, Nosun, CHEN, Wei-Chuan, KIM, Jonghae, YU, Xiaoju, MUDAKATTE, Niranjan Sunil
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
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Beschreibung
Zusammenfassung:Aspects of the present disclosure provide three-dimensional (3D) through-glass-via (TGV) inductors for use in electronic devices. In some embodiments, a first portion of a 3D TGV inductor may be formed in a first wafer and a second portion of a 3D TGV may be formed in a second wafer. The first portion and second portion may be bonded together in a bonded wafer device thereby forming a larger inductor occupying relatively little wafer space on the first and the second wafers.