Epoxy-Silicone Hybrid Sealant Composition with Low Shrinkage and Lower Postcuring Properties with Chemical Resistance for Aerospace Applications

Epoxy-Silicone Hybrid Sealant Composition with Low Shrinkage and Lower Postcuring Properties with Chemical Resistance for Aerospace Applications

In one aspect of the present disclosure, there is provided a sealant precursor, comprising a first part (A) comprising (a1) an epoxy curing agent having an amine equivalent weight of at least 150 grams per mole of amine equivalents; (b1) a first epoxy curative; a second part (B) comprising (a2) a bl...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Bardts, Mareike
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In one aspect of the present disclosure, there is provided a sealant precursor, comprising a first part (A) comprising (a1) an epoxy curing agent having an amine equivalent weight of at least 150 grams per mole of amine equivalents; (b1) a first epoxy curative; a second part (B) comprising (a2) a blend of epoxy resins comprising at least one bisphenol A epoxy resins and at least one bisphenol F epoxy resin; (b2) at least one silicone-based resin comprising epoxy functionalities; (c2) optionally, a toughener.