Laser processing hydrogel materials

A method of forming one or more perforations, holes, or capillaries in a hydrogel material, hydrocolloid material, hydrogel adhesive or silicone adhesive comprising directing a focal point of a laser beam to a surface of the material or adhesive at one or more locations to form one or more perforati...

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Bibliographische Detailangaben
Hauptverfasser:	Arvey, Ken, Miller, Daniel B, Swanson, Alexandra, Hill, Kimberly
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method of forming one or more perforations, holes, or capillaries in a hydrogel material, hydrocolloid material, hydrogel adhesive or silicone adhesive comprising directing a focal point of a laser beam to a surface of the material or adhesive at one or more locations to form one or more perforations, holes, or capillaries having a selected diameter. The perforated hydrogel material or adhesive can be used in wound care dressings, wearable sensors, or devices intended to contact living tissue. The perforated material or adhesive may also be provided in contact with an exudate holding mechanism such as an open cell foam material to further increase the exudate absorbance of the hydrogel or hydrocolloid wound care dressing.